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PCB Technology

PCB Design

PCB Manufacturing

 

Products

Probe Card Boards

Final Test Boards

Burn-In Boards

Other Boards

 

 

Contact

Email

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  DESIGN

aps uses various specialised designers in order to produce the right designs for our customers application.

Dependend on the technical requirement aps will use the fitting specialist and is taking care for the appropriate and optimal design solution.

Through our Design Partners there are Templates for all major Test Systems available

Designer on Site are available upon request

The Design software used beside others is mainly 

  • PADS
  • P-CAD
  • CADENCE
  • CADSTAR
  • ALTIUM
  • PROTEL

 
   
Probe Cards for Wafer Probing of Memory, Logic, Chip Card and LCD Devices  
 Test Sockets for IC Component Test - High-Performance Production Test Sockets and Contactors  

 System for Probe Card Repair and Test

 aps Sales & Service GmbH - The European representative of the market leaders in Wafer Probing and IC Device Test

 

Design Highlights

  • Schematic capture

  • Netlist (IPC standard)

  • Multi layer design up to 34 layer

  • Mechanical pcb design

  • RF requirements

  • Differential pairs, equal length

  • Split power planes

  • Impedance controlled layout

  • Blind and buried via

  • Mother daughter solutions

  • Analog / digital / mixed Signals

  • Offset via

  • Fine pitch design / BGA design

  • Bill of Material

  • Documentation

 aps can provide solutions for:

 

Tester

Type

Probe Card

Load Board

Teradyne

J750-512 

Y

Y

Teradyne

J750-1024

Y

Y

Teradyne

Catalyst 9”

Y

 

Teradyne

Catalyst

 

Y

Spea

C372MXF

 

Y

LTX

Fusion

Y

 

Agilent / Verigy

AG93K

Y

Y

Agilent / Verigy

HP83K

 

Y

Credence

Duo

Y

Y

Credence

Quartet

Y

Y

Upon request there can be done designs for any other tester system.
         
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Please contact aps for more information! 

 

Phone: 

0049 - (0)89-841 027-20

Fax:

0049 - (0)89-841 027-11

E-Mail

devicetest@aps-munich.com
   

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