Home - Multilayer PCB - PCB Technology
High-Performance Multilayer Printed Circuit Boards for ATE Applications, Blank Boards for Probe Cards - Handler Interface Boards - Test Boards - Burn in Boards - Engineering and Demo Boards    
 

Introduction

 

PCB Technology

PCB Design

PCB Manufacturing

  

 

TECHNOLOGY

aps is working with manufacturing partners which offer a range of high tech capabilities:

  • Up to 50 Multi-Layers
  • Thickness: up to 6,5 mm
  • Maximum Board Size 700 x 950 mm (ML)
  • Designs up to 10 GHz.
  • Micro BGA boards down to 0,3 mm pitch.
  • Blind and Buried Vias (Staggered/stacked microvias)
  • Hole diameter down to 0.1mm.
  • Minimum Line width down to 40µm
  • Controlled impedance tolerance 50 Ohm +/- 10% , 5 % upon request
  • Component Placement
  • Board Assembly
  Products:  
 

Probe Card Boards

Final Test Boards

Burn-In Boards

Other Boards

 

 

 

Contact

Email

Phone

 

 
       
Probe Cards for Wafer Probing of Memory, Logic, Chip Card and LCD Devices   MATERIAL 

 Test Sockets for IC Component Test - High-Performance Production Test Sockets and Contactors

 System for Probe Card Repair and Test

  

Only the best materials are used, suitable to your application:

FR4, High TG epoxy, High frequency, Thermount, CIC, Halogenfree from suppliers like NELCO, CE, Rogers, Getek and others.

Surface finishes available : OSP, HASL lead-free, Chem./Electrolytic Ni/Au, SnPb, Chem. Sn, Chem. Agp
 aps Sales & Service GmbH - The European representative of the market leaders in Wafer Probing and IC Device Test    
     
     
  Site Map  

Please contact aps for more information! 

 

Phone: 

0049 - (0)89-841 027-20

Fax:

0049 - (0)89-841 027-11

E-Mail

devicetest@aps-munich.com
  Home  
  Impressum   
 
   

PROBECARDS - MULTILAYER PCB - TEST SOCKETS -  EQUIPMENT - SERVICE - COMPANY - HOME
Site Map - Impressum - Webmaster- www.aps-munich.com  

Web Site Design: www.hermann-fuchs.de