Optimized equipment for Probing and Sorting LED wafer to bin frame in one system

• Minimum floor space

• Eliminates operation failures.

• Allows independent operation for probing and sorting system.

Applications:

• LED

• Semiconductor

• MEMS

• Discrete Elements

Features:

Probing:

• Precise driving system for probing

• Flexible alignment methods

• Various wafer/chip type

Sorting:

• Auto theta calibration

• A VCM head is employed to achieve ultra-low programmable pick & place force

• Advanced defect detection.

• Up to 200 bins