Test Sockets

Spring Pin Crown Type

Spring Pin Test Socket

BGA – LGA – SO – TSOP I & II – QFP – LCC – QFN/MLF/MLP – CSP – MCM – WLCSP

  • Including Kelvin options for all package types, Coaxial Sockets
  • Pitches < 0,2 mm
  • Kelvin / Force & Sense Pitch 0,4mm
  • High Current
  • Low spring pin force
  • Non (low) magentic characteristic
  • >1000k insertions
PCR Sheet

PCR Test Socket

With Pressure sensitive Conductive Rubber (PCR) type sockets the current is conducted by the pressure added on the PCR bump that leads to complete connection between the PCB/LB pads and solder balls.Typical applications with BGA - LGA - QFN

  • Pitches down to 0.3mm
  • High frequencies up to 14 GHz@-1dB
  • Min. contact resistance: ~ 20mΩ
  • Up to 3000 contacts
Rigid Pin Socket

Rigid Pin Test Socket

“W Contact" rigid-type for high performance test

 SOP – SSOP – TSSOP – QFP – QFN - PLCC – LCC …

  • Including Kelvin options for all package types
  • Pitches >= 0,3mm
  • Kelvin / Force & Sense option
  • High frequency (12,8GhZ@-1dB)
  • Current up to 2A
Coaxial Pin arrangement

Coaxial Test Socket

  • Pitch 0.5, 0.65, 0.8 1.0 and 1.27 mm

  • Up to 13 Ghz operating frequency

  • Impedance controlled for 50Ω, 75Ω or 90 Ω

  • minimize electrical noise

  • great EM wave shielding

  • high frequency performance

WLSCP Pin area with bold head top Plunger

WLCSP / CSP

  • For bumped Wafer and Alu pads
  • Pitches <0,2 possible
  • Planarity  ± 35µm
  • Bandwidth 6 Ghz
  • Current Rating  >1A (0,4mm Pitch)
  • Pitches < 0.2mm
  • Kelvin / Force & Sense (0.4mm pitch)
  • Lifetime >1000k
  • Universal Probe Head Option
ATC Thermal Head

  Active Thermal Control (ATC)

  • For monitoring the IC´s testing temperature during characterization
  • Max Temperature range (without loading): -60°C - +150°C
  • Temperature Accuracy: +-0,1°C (constant loading)
  • TEC cooling power (customized selection): 460W max
  • Termerature input: t-Type termocouple
  • Ramping time (without loading):
    • Ambient to +150°C: ~130sec,                   
    • Ambient to -60°C: ~400sec
  • Die Crack prevention
  • Over Temperature protection
  • Customized software GUI
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