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Test Sockets for IC Component Test - High-Performance Production Test Sockets and Contactors   PACKAGES SMD TYPES
 

 

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Packages

 

Below you see a sample selection of SMD packages types suitable to WIN WAY Sockets:

 
BQFP
Bumped Quad Flat Package
BQFPH
Bumped Quad Flat Package with Heat spreader
CABGA
Chip Array Ball Grid Array
CBGA
Ceramic Ball Grid Array
CQFP
Ceramic Quad Flat Package
CTBGA
Thin Chip Array Ball Grid Array
CVBGA
Very Thin Chip Array Ball Grid Array
DFN
Dual Flat No-lead Package
DFP
Dual Flat Pack
DRMLF
Dual Row Micro Leadframe Package
FBGA
 Fine Ball Grid Array
FCmBGA
Flip Chip Molded Ball Grid Array
FQFP
Fine Pitch Quad Flat Package
HQFP
Heat sinked QFP
HSOP
Thermally Enhanced Small-Outline Package
HTSSOP
Heat-Sink Thin Small-Outline Package
LFBGA
Low-profile Fine-pitch Ball Grid Array
LGA
Land grid array
LQFP
Low Profile Quad Flat Package
MBGA
Micro Ball Grid Array
MCM-PBGA
Multi-Chip Module Plastic Ball Grid Array
MLPD
Micro Leadframe Package Dual
MLPM
Micro Leadframe Package Micro
MLPQ
Micro Leadframe Package Quad
MQFP
Metric Quad Flat Package
PBGA
Plastic Ball Grid Array
PBGA
Plastic Ball Grid Array
PQFP
Plastic Quad Flat Package
QFN
Quad Flat No-lead Package
QFN-TEP
Quad Flat No-lead package with Top Exposed Pad
SBGA
Super Ball Grid Array
SOD
Small Outline Diode
SOP
Small-Outline Package
SOT
Small Outline Transistor
SQFP
Small Quad Flat Package
SSOP
Shrink Small Outline Package
TABGA
Tape Array BGA
TBGA
Tape Array BGA
TDFN
Thin Dual Flat No-lead Package
TEPBGA
Thermally Enhanced Plastic Ball Grid Array
TFBGA
Thin and Fine Ball Grid Array
TFP
Triple Flat Pack
TO
Transistor Single Outline
TQFN
Thin Quad Flat No-lead Package
TQFP
Thin Quad Flat Package
TSOP
Thin Small Outline Package
TSSOP
Thin Shrink Small Outline Package
TVSOP
Thin Very Small-Outline Package
UBGA
Ultra Fine Ball Grid Array.
UFBGA
Ultra Fine Ball Grid Array
UTDFN
Ultra Thin Dual Flat No-lead Package
VQFN
Very Thin Quad Flat No Leads Package
VQFP
Very small Quad Flat Package
VSOP
Very Small-Outline Package
VTQFP
Very Thin Quad Flat Package
XDFN
Extreme thin Dual Flat No-lead Package
   
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Probe Cards for Wafer Probing of Memory, Logic, Chip Card and LCD Devices

     
High-Performance Multilayer Printed Circuit Boards for ATE Applications, Blank Boards for Probe Cards - Handler Interface Boards - Test Boards - Burn in Boards - Engineering and Demo Boards  
 
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Please contact aps for more information! 

 

Phone: 

0049 - (0)89-841 027-20

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0049 - (0)89-841 027-11

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