Standard Spring Pin

BGA – LGA – SO – TSOP I & II – QFP –

LCC – QFN/MLF/MLP – CSP – MCM – WLCSP

Including Kelvin options for all package types, Coaxial Sockets

• Pitches < 0,2 mm

• Kelvin / Force & Sense Pitch 0,4mm

• High Current

• Low spring pin force

• Non (low) magentic characteristic

• >1000k insertions

Please click HERE to find out more about Win Way Spring Probe Test Sockets and Contactors.

"U Contact" rigid-type for high performance test

SOP – SSOP – TSSOP – QFP – QFN - PLCC – LCC …

Including Kelvin options for all package types

• Pitches >= 0,3mm

• Kelvin / Force & Sense option

•  High frequency (12,8GhZ@-1dB)

•  Current up to 2A

•  Competitor compatible footprint possible

Please click HERE to find out more about the Win Way Rigid Pin Test Sockets and Contactors.

With Pressure sensitive Conductive Rubber Sockets (PCR) type sockets the current is conducted by the pressure added on the PCR bump that leads to complete connection between the PCB/LB pads and solder balls. Typical applications with BGA - LGA - QFN

• Pitches down to 0.3mm

• High frequencies up to 14 GHz@-1dB

• Min. contact resistance: ~ 20mΩ

• Up to 3000 contacts

Please click HERE to find out more about the Win Way PCR-type Test Sockets and Contactors.

• Pitch 0.5, 0.65, 0.8 1.0 and 1.27 mm

• Up to 13 Ghz operating frequency

• Impedance controlled for 50Ω, 75Ω or 90 Ω

• minimize electrical noise

• great EM wave shielding

• high frequency performance

Please click HERE to find out more about the Win Way Coaxial Test Socket

For BGA and LGA applications

• Standard Spring Pin

• Kelvin options

• Pitches < 0,4 mm

• Kelvin / Force & Sense Pitch 0,4mm

• High Current

Please click HERE to find out more about the Win Way PoP Sockets

ATC – for monitoring the IC´s testing temperature during characterization

• Max Temperature range (without loading): -60°C - +150°C

• Temperature Accuracy: +-0,1°C (constant loading)

• TEC cooling power (customized selection): 460W max

• Termerature input: t-Type termocouple

• Ramping time (without loading): ambient to +150°C: ~130sec,                    ambient to -60°C: ~400sec

• Die Crack prevention

• Over Temperature protection

• Customized software GUI

Please click HERE to find out more about the Win Way Active Thermal Control

• Pitches 0,75mm, 0,80mm 1,00mm

• Min. Contact force: 10g

• Max Contact force: 120g

• Bandwidth up to 30Ghz

• Contact resistance: <10mΩ

• Travel: 0.1mm … 0.2mm

Please click HERE to find out more about the Win Way Interposer Superbutton

• Pitches 150µm possible

• Planarity  ± 35µm

• Bandwidth 6.1 Ghz (@-1dB)

• Current Rating  >1A (0,4mm Pitch)

• Lifetime >1000k

• Easy in Operation

• Easy to Maintain

• Capable of Singulated Die Test

• Long contact travel (OD up to 200um)

Please click HERE to find out more about the Win Way Spring Pin Probecard

WLCSP / CSP - For bumped Wafer and Alu pads

• Pitches <0,2 possible

• Planarity  ± 35µm

• Bandwidth 6 Ghz

• Current Rating  >1A (0,4mm Pitch)

• Pitches < 0.2mm

• Kelvin / Force & Sense (0.4mm pitch)

• Lifetime >1000k

• Universal Probe Head Option

Please click HERE to find out more about the Win Way WLCSP Test Sockets