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  Spring Probe & other Application Examples
for Engineering, System Level Test, Production (ATE) Test and Wafer Probing

Below you see a sample selection of Spring Probe and other test contactors (for various packages and test handlers) that we have done and which helped our customers to efficiently test their devices in various application fields and hardware environments.

Spring Pin

Package: BGA1117 40x40 mm
Pitch:      1.0 mm
Power:     30 W

Handler:   Synax 1701
Tester:     Agilent 93k

RFQ Form    
 

Spring Pin

Package: QFN48 7x7 mm
Pitch:       0.5 mm

Handler:   manual test only

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Probe Cards for Wafer Probing of Memory, Logic, Chip Card and LCD Devices    

High-Performance Multilayer Printed Circuit Boards for ATE Applications, Blank Boards for Probe Cards - Handler Interface Boards - Test Boards - Burn in Boards - Engineering and Demo Boards

aps Sales & Service GmbH - The European representative of the market leaders in Wafer Probing and IC Device Test

 

Spring Pin

 

4 modules optical openings

extra LED support (red / green)

customized Stiffener

 

         
Site Map

Universal WLCSP Probe head with Spring Pins

 

0,4 mm Pitch

16 DUT

DUT Matrix 2x3

DUT arrangement 2x8

144 Pins

 
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Rigid Pin - "U-Contact"

 

Package outline:  14mm x 14mm

Pitch:                    0,5 mm

Pin Count:             100

 

     
     
     
     
     
 
     

PCR (Pressure Conductive Rubber)

 

FCBGA (Flip Chip BGA)

Package size:       29x29

Ball matrix:           M35x35

Pitch:                    0,8mm

 

     
     
     
     
     
     
     
         
         
       
     

Please contact aps for more information! 

 

Phone: 

0049 - (0)89-841 027-20

Fax:

0049 - (0)89-841 027-11

E-Mail

devicetest@aps-munich.com

   
   
     
   

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