The Spring Probe Pin (also known as "Pogo-Pin") is probably the most utilized and most flexible test contactor pin today. It is available in various structures, diameters and lengths to cover almost any kind of device or application.

Spring Probes offer straight vertical contacts with 1:1 DUT pattern footprints, which makes them perfect for array devices like BGA, LGA and PGA (e.g. ACTEL, ALTERA, LATTICE, QUICKLOGIC and XILINX FPGA's) - but due to their versatility they are perfect for QFN/MLF/MLP, QFP, SOP, LCC, CSP and even FPC's or MCM modules, too.

Pitches can be as small as 0.3mm (and even smaller), pin counts up to more than 2000.

The sockets are precisely machined in durable engineering plastics, and feature patented design structures for optimal alignment and best contact.

Our Spring Probe test sockets are designed for a large variety of ICs including high test frequencies of 20+ GHz for computing & graphics ICs, Bluetooth, RF modules, amplifiers, microcontrollers, power management devices, CMOS image sensors etc.

They are ideal for production Final Test, low volume hand-test and engineering purposes like SLT (System Level Test), and also for highly cost-effective WLP / WCSP / WLCSP vertical wafer probing applications.

The sockets are available for full compatibility to existing contactors with 1:1 DUT patterns (e.g. Antares, Synergetix, ECT), and feature various lid types without and with passive or active cooling, or even with integrated air-blow channels.

Of course, our sockets feature sufficient space for SMD components close to the DUT.

Win Way dedicated Spring Probes come in an infinite variety and are available with self inductance down to 0.2nH, and to a bandwidth up to 22 GHz at -1dB.

Other features are long cycle lifetime, high reliability and easy maintenance for cost-effective test of your devices.

Of course, our Spring Probes are optimized for lead-free
pad & lead materials like matte Sn and SnAgCu!

• BGA, LGA, PGA

• QFN, DFN, MLF, MLP

• CSP, WLP

• QFP

• SOP, TSSOP, SON, ...

• PLCC, LCC, ...

• MCM, Ceramic modules

Material: BeCu or steel with Au or PdCo finish

Tip shapes: various crowns, conical, etc.

Bandwidth: up to 50 GHz available!!

Continuous current: up to 5.0A per pin

• < 0.3 mm available

• -40 °C to +125 °C