Home - Test Sockets  - PoP Package on Package
Test Sockets for IC Component Test - High-Performance Production Test Sockets and Contactors   PoP - Package on Package Test Socket
  Introduction

 

Technologies

 

Application Examples

 

Service & Support

 

Packages

 

Package on Package Socket (PoP)

  

 

For BGA and LGA applications

  • Standard Spring Pin

  • Kelvin options

  • Pitches < 0,4 mm

  • Kelvin / Force & Sense Pitch 0,4mm

  • High Current

 
Top View Bottom View
RFQ Form      
   
Contact
Email
Phone
     

Probe Cards for Wafer Probing of Memory, Logic, Chip Card and LCD Devices

  
High-Performance Multilayer Printed Circuit Boards for ATE Applications, Blank Boards for Probe Cards - Handler Interface Boards - Test Boards - Burn in Boards - Engineering and Demo Boards  
 
aps Sales & Service GmbH - The European representative of the market leaders in Wafer Probing and IC Device Test  
           
  Site Map        
  Home        
  Impressum    
     

Please contact aps for more information! 

 

Phone: 

0049 - (0)89-841 027-20

Fax:

0049 - (0)89-841 027-11

E-Mail

devicetest@aps-munich.com

     To Win Way Homepage

  
   
     
   

PROBECARDS - MULTILAYER PCB - TEST SOCKETS - EQUIPMENT - SERVICE - COMPANY - HOME
Site Map - Impressum - Webmaster- www.aps-munich.com  

Web Site Design: www.hermann-fuchs.de