Advanced Cantilever

Proved Probing with Cantilever Probe Cards for CUP, LOW-K , POAA with Standard Over Drive!

For significant less mechanical stress to the pad and shorter scrub length by defined tip friction and keeping reliable low contact resistance

Advantage: Avoid pad cracks and active structure damage by 

1. Reducing the contact force and needle tip pressure
2. Reducing lateral tension between pad layers and Silicon

Typical Parameters

• Contact Force:                      ~ 30mN @ standard OD
• OD                                           60 µm
• Tip Diameter:                         15 ~ 25 µm
• Tip Length                              typical 250 µm first layer
• Planarity                                 < + / - 10 µm
• max. No of TD on Pad:           Customer defined

For available Configurations and feasibility study with detailed FEM-Analysis please get in contact with us and fill out the document RFQ/Feasibilty Study Form and send to: wafertest@aps-munich.com

Document for Download: RFQ/Feasibilty Study Form