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High-Speed Cantilever
Application & Products    
  Cantilever Type   Suitable for High Speed Testing
    Conventional   High Speed Cantilever Technology R+ ®  
    Advanced  

Concept: Signal Pin with Impedance compensation by shielding pin which improves the frequency performance

Highlights:

  • For analog up to 3GHz
  • Quasi- Coaxial
  • Signal-Pin with adjacent GND-line for impedance-matching
  • Detailed analysis for feasibility
  • Minimum Pitch: 50µm Inline; 38µm/76µm Staggered or 2 rows
  • Test-Temperature -40°C ~ 150°C
  • Multi-DUT
  • Combinable with Standard Cantilever
  • For CUP/POAA/POA/POC 
  • Max. Current 300mA high-speed-data

For available Configurations and feasibility study with detailed FEM-Analysis please get in contact with us and fill out the document RFQ/Feasibilty Study Form and send to: wafertest@aps-munich.com

Document for Download: RFQ/Feasibilty Study Form
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