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Probe Cards for Wafer Probing of Memory, Logic, Chip Card and LCD Devices   PROBE CARD Applications & Products - CANTILEVER
 

Introduction

  

High Temperature Cantilever
Application & Products   Suitable for parametric or automotive applications and others
  Cantilever Type              
    Conventional  

Sandwich

      

High Temperature

  
    Advanced   Technology  

 

   Technology  
    High Speed            
    High Temperature   Operating     Operating  
        Temperature     Temperature  
        -40°C up to 180°C       -40°C up to 250°C  
           

 

    
  Vertical Type    

CHARACTERISTICS

SPECIFICATION

Probe Material

Tungsten,

Rhenium-Tungsten, Beryllium-Copper

Probe Tip Shape

Radius,

Flat,

Semi-Radius

Probe Tip Diameter

6µ – 150µ

Probe Tip Length

200µ - 450µ

Layer

1, 2

Probe Tip Planarity

~ 10µ

x/y Position Accurary

+- 10µ, +-5µ
Probe Tip Depth from 2,5 mm

Max Current / Probe

up to 0,8A
   
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