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Probe Cards for Wafer Probing of Memory, Logic, Chip Card and LCD Devices   PROBE CARD Applications & Products - Vertical
 

Introduction

 

Vertical Probecard Technology

Application & Products   Suitable for Logic / Chip Card / SoC / High Speed / Optical Sensors / Memory / CMOS / WLCSP
  Cantilever Type    
  Vertical Type   Highlights  
       
  • Modular Design Concept
  • Multi DUT Peripheral / Full Array Test for Logic IC
  • Test Temperature range for one probe-card -40°C ~ 150°C
  • Flat and Round Needle Tips available
  • High Speed Test with HF-Probe Head
  • New Space Transformer Interface Solutions with HW/MLO/MLC/INT
  • High Frequency for Hand-Wired Vertical PC (Hand-Wired Space-Transformer: 900MHz @-3dB)
  • Flexible Assembly @ High performance
  • Reduced cross-talk

Fine-Pitch PC-Assembly:

Min. Pitch: Peripheral Layout: 80µm
  Near Array Layout: 115µm
Min. Pad Size:   50x50µm

High Parallel
Hand-Wired and Multi-Layer Space-Transformer and direct-Attach PC-assembly (x8, x16, x32, x64, x128, x256, x512)

Non-Floating Probe-Head assembly
For permanent electrical and mechanical docking of Probehead to Space-Transformer

  • lower and stable electrical resistance
  • no damage to landing-pad

chipcard

CHIP CARD
240 DUT Parallel Test
1200 P7 Pins
ML Space-Transformer
Test-Temperature: 25 - 125°C
Customized PCB
Full Application-Area Steeltop

Logic

LOGIC
16 DUT Parallel Test
112 P7 Pins
Non-Floating ProbeHead Design
HandWired Space-Transformer
Test-Temperature: -40 - 85°C
Universal Cantilever PCB

       
       
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aps Sales & Service GmbH - The European representative of the market leaders in Wafer Probing and IC Device Test Force/Sense Measurement Option:

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Basic Specifications:

vertical-2

 
   

For available Configurations and feasibility study with detailed FEM-Analysis please get in contact with us and fill out the document RFQ/Feasibilty Study Form and send to: wafertest@aps-munich.com

Document for Download: RFQ/Feasibilty Study Form

 

 
    Please contact aps for more information!   
       
     
Phone:  0049 - (0)89-841 027-10
Fax: 0049 - (0)89-841 027-11
E-Mail wafertest@aps-munich.com
     

 

   

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