Introduction

Logic / LCD / Chip Card / Memory / Optical Sensors / CMOS / RF / HF / Parametric / WLCSP

• Probe-cards for engineering
• Multi-DUT PC for mass-production
• High End Probe-Cards for tricky applications
• Low pin count probe-cards
• High pin count 2000+
• Low Force for Active Area Structure underneath the Pads
• Test temperature from -40°C up to 160°C
• Fine pitch and ultra fine pitch
• With special components
• Needle Material for Gold Pads
• High Speed Signals
• High Frequency requirements up to 3 GHz
• One hand solution for high quality PCB and Needle Assembly
• Personalized PCBs for all available technologies
• Solder Land Design for best performance
• Long term reliability and finest accuracy in testing
• Quality Service Support like Repair and Refreshment
• Ring-Exchanges
• Special Requirements, e.g. integrated FPGA chip

Just get in contact with us and let us introduce our outstanding technology and give you the best possible support to make your applications working perfect.

Please download and fill out the document RFQ/Feasibilty Study Form

and send to: wafertest@aps-munich.com

Document for Download: RFQ/Feasibilty Study Form

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